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FCC E6E - 电路元件与半导体

FCC 题库总览 > E级 (最高特级 Extra) > E6 电路元件与半导体 > E6E

小节 E6E:电路元件与半导体

本小节共包含 12 道中英双语精校考题
#E6E01🔗
Why is gallium arsenide (GaAs) useful for semiconductor devices operating at UHF and higher frequencies?
为什么砷化镓 (GaAs) 对于在 UHF 和更高频率下运行的半导体器件有用?
A
Higher noise figures
更高的噪声系数
B
Higher electron mobility
更高的电子迁移率
✓ 正确答案
C
Lower junction voltage drop
更低的结压降
D
Lower transconductance
更低的跨导
#E6E02🔗
Which of the following device packages is a through-hole type?
以下哪种器件封装是通孔型?
A
DIP
双列直插式
✓ 正确答案
B
PLCC
PLCC
C
BGA
球栅阵列
D
SOT
索特
#E6E03🔗
Which of the following materials supports the highest frequency of operation when used in MMICs?
以下哪种材料在 MMIC 中使用时支持最高工作频率?
A
Silicon
B
Silicon nitride
氮化硅
C
Silicon dioxide
二氧化硅
D
Gallium nitride
氮化镓
✓ 正确答案
#E6E04🔗
Which is the most common input and output impedance of MMICs?
MMIC 最常见的输入和输出阻抗是什么?
A
50 ohms
50欧姆
✓ 正确答案
B
300 ohms
300欧姆
C
450 ohms
450欧姆
D
75 ohms
75欧姆
#E6E05🔗
Which of the following noise figure values is typical of a low-noise UHF preamplifier?
以下哪个噪声系数值是低噪声 UHF 前置放大器的典型噪声值?
A
0 . 5 dB
0 . 5分贝
✓ 正确答案
B
-10 dB
-10分贝
C
44 dBm
44分贝
D
-20 dBm
-20分贝
#E6E06🔗
What characteristics of MMICs make them a popular choice for VHF through microwave circuits?
MMIC 的哪些特性使其成为 VHF 通过微波电路的热门选择?
A
The ability to retrieve information from a single signal, even in the presence of other strong signals
即使存在其他强信号,也能够从单个信号中检索信息
B
Extremely high Q factor and high stability over a wide temperature range
在宽温度范围内具有极高的品质因数和高稳定性
C
Nearly infinite gain, very high input impedance, and very low output impedance
接近无限的增益、非常高的输入阻抗和非常低的输出阻抗
D
Controlled gain, low noise figure , and constant input and output impedance over the specified frequency range
受控增益、低噪声系数以及在指定频率范围内恒定的输入和输出阻抗
✓ 正确答案
#E6E07🔗
What type of transmission line is often used for connections to MMICs?
哪种类型的传输线通常用于连接 MMIC?
A
Miniature coax
微型同轴电缆
B
Circular waveguide
圆形波导
C
Parallel wire
平行线
D
Microstrip
微带线
✓ 正确答案
#E6E08🔗
How is power supplied to the most common type of MMIC?
最常见类型的 MMIC 是如何供电的?
A
Through a capacitor and RF choke connected to the amplifier input lead
通过电容器和射频扼流圈连接到放大器输入引线
B
MMICs require no operating bias
MMIC 不需要操作偏差
C
Through a resistor and/or RF choke connected to the amplifier output lead
通过连接到放大器输出引线的电阻器和/或射频扼流圈
✓ 正确答案
D
Directly to the bias voltage (Vcc) lead
直接连接至偏置电压 (Vcc) 引线
#E6E09🔗
Which of the following component package types have the least parasitic effects at frequencies above the HF range?
以下哪种元件封装类型在高于 HF 范围的频率下寄生效应最小?
A
TO-220
TO-220
B
Axial lead
轴向导程
C
Radial lead
径向导程
D
Surface mount
表面贴装
✓ 正确答案
#E6E10🔗
What advantage does surface-mount technology offer at RF compared to using through-hole components?
与使用通孔元件相比,表面贴装技术在射频领域具有哪些优势?
A
Smaller circuit area
电路面积更小
B
Shorter circuit board traces
更短的电路板走线
C
Components have less parasitic inductance and capacitance
元件寄生电感和电容较小
D
All these choices are correct
所有这些选项都是正确的
✓ 正确答案
#E6E11🔗
What is a characteristic of DIP packaging used for integrated circuits?
集成电路用DIP封装有什么特点?
A
Extremely low stray capacitance (dielectrically isolated package)
极低的杂散电容(介质隔离封装)
B
Extremely high resistance between pins (doubly insulated package)
引脚间极高的电阻(双重绝缘封装)
C
Two chips in each package (dual in package)
每个封装两个芯片(双封装)
D
Two rows of connecting pins on opposite sides of package (dual in-line package)
封装相对两侧有两排连接引脚(双列直插式封装)
✓ 正确答案
#E6E12🔗
Why are DIP through-hole package ICs not typically used at UHF and higher frequencies?
为什么 DIP 通孔封装 IC 通常不用于 UHF 和更高频率?
A
Excessive dielectric loss
介电损耗过大
B
Epoxy coating is conductive above 300 MHz
环氧树脂涂层在 300 MHz 以上具有导电性
C
Excessive lead length
引线长度过长
✓ 正确答案
D
Unsuitable for combining analog and digital signals
不适合组合模拟和数字信号
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